Nov 28, 2022
SiLENSe version 6.5 has been released. New version supports simulation of heterostructures including tunnel junctions. Tunnel junctions can be used to connect different cascades of LED/LD structures or enable replacing p-contact by combination of TJ and n-contact. The...
Nov 2, 2022
VR software for simulation of PVT SiC can now be used to estimate the expected wafer warpage for different positions of the slice in SiC boule. The model is based on the plastic strain inherited by the wafer from the crystal, which results in the wafer deformation...
Oct 5, 2022
PolySim and PolySim 3D version 2022.10 have been released. The main new features are: – Better integration between PolySim and PolySim 3D. – Popcorn simulation is introduced in PolySim3D. The user can find and analyze the popcorn locations on the rod...
Dec 14, 2021
SiLENSe version 6.4 has been released. Simulation of photoluminescence (PL) is updated in such a way that carriers generated by PL excitation are included into the main drift-diffusion computations. As userscan specify the p-n junction bias together with PL...
Dec 10, 2021
STR-China (Suzhou STR Software Technology Co., Ltd.) has participated in The 7th International Forum on Wide Bandgap Semiconductors & The 18th China International Forum on Solid State Lighting held jointly on December 6-8, 2021, in Shenzhen, China. As one of the...
Oct 25, 2021
STR has published a new paper: “Critical aspects of AlGaInP-based LED design and operation revealed by full electrical-thermal-optical simulations” by Olga Fedorova, Kirill Bulashevich, and Segrey Karpov. It is available as an open access publication. All...
