VR software for simulation of PVT SiC can now be used to estimate the expected wafer warpage for different positions of the slice in SiC boule. The model is based on the plastic strain inherited by the wafer from the crystal, which results in the wafer deformation after cutting. Contact us for more information on this option. See the software page for more options in simulation of PVT SiC.
New option for PVT SiC
